Kandou AI Demonstrates Revolutionary 260 Gbps Tigerwing™ Chip-to-Chip Interface in Silicon at 2026 TSMC Europe Technology Symposium

SAINT-SULPICE, SWITZERLAND— June 4, 2026 — Kandou AI, a leading fabless semiconductor company specializing in high-speed, energy-efficient connectivity and system solutions for the AI era, today announced the successful silicon demonstration of its industry-leading Tigerwing™ Chip-to-Chip (C2C) SerDes interface on TSMC’s 4nm technology node. The demonstration took place at the…