Our mission

To increase the energy efficiency of electronic devices and systems.

Why Kandou?

We enable faster and more energy efficient interconnects with a smaller physical footprint than competing technologies. Our chip connection technologies improves the speed to power consumption trade-off frontier.

Our journey

Scroll down to see our journey.


Our journey

Bessemer Venture Partners and Walden International invest $15 million in Kandou's Series-B

Kandou announces the availability of the Glasswing IP

Kandou opens a design office in Dortmund, Germany

Bessemer venture partners invests $15 million in Kandou's Series-A

Kandou Licenses Glasswing SerDes Technology to Marvell

Working Glasswing chip

Transmits 125 Gbps over 6 correlated wires over 12-24 mm of trace in an MCM

DesignCon best paper award


Jan van Vessem award

Firefly 40 tapeout

Kandou opens a design office in Northampton, UK

Seed funding

Firefly 90 tapeout