Awards to be presented at the GSA Awards celebration on December 8. Kandou, an innovative leader in high-speed, energy-efficient chip-to-chip link solutions that improve the way the world connects and communicates, has been named one of the four finalists in the Global Semiconductor Alliance (GSA) Outstanding EMEA Semiconductor Company Award category.
Kandou’s Dr. Amin Shokrollahi will attend the Morgan Stanley European Technology, Media & Telecom Conference What: They will present Kandou’s vision and product offerings in one-on-one or group meetings with interested investors throughout the Conference. When: Wednesday, November 16, to Friday, November 18. Who: Kandou’s Dr. Amin Shokrollahi, founder and CEO, and Jeff…
Kandou’s Dr. Amin Shokrollahi will be attending Bank of America investor summit What: Bank of America is hosting the latest in the ‘Trailblazer Investor Summits’ which will be held in central London. With investment at the heart of this summit, the agenda includes a number of thought-provoking key notes depicting current…
The Beginning Close up of a woman hand plugging an usb pendrive on a laptop at home Ever since its inception in 1996, the Universal Serial Bus (USB) has been a ubiquitous standard for connecting devices in the consumer space. Many of us don’t even remember computers without a USB…
Serial private and public company CEO offers invaluable technology leadership experience. Kandou, an innovative leader in high-speed, energy-efficient chip-to-chip link solutions that improve the way the world connects and communicates, today named Tom Lacey, former serial private and public company CEO, to its board of directors. Lacey joins Kandou as…
Will Host Investor One-on-One or Group Meetings Who: Jeff Winzeler, CFO of Kandou, an innovative leader in high-speed, energy-efficient, chip link solutions What: Will hold a series of one-on-one or group meetings with interested investors in the Morgan Stanley NextGen Conference When: Wednesday, June 22 Where: Rosewood Hotel, London. For more details, see Morgan…
Kandous’s new office to accommodate sales, field and corporate applications, testing and debug labs, and quality assurance. LAUSANNE, SWITZERLAND –– APRIL, 28, 2022 –– Kandou, an innovative leader in high-speed, energy- efficient chip-to-chip link solutions to improve the way the world connects and communicates, today opened its first office in Taipei,…
Package Variation Provides More Host System Design Flexibility LAUSANNE, SWITZERLAND –– MARCH, 01, 2022 –– Kandou, an innovative leader in high-speed, energy- efficient chip-to-chip link solutions to improve the way the world connects and communicates, today began volume production of its second variation in the Matterhorn family of USB4™ retimers. Our…
New Facility Accommodates Employee Growth in Scotland LAUSANNE, SWITZERLAND –– January 25, 2022 –– Kandou, an innovative leader in high-speed, energy- efficient chip-to-chip link solutions to improve the way the world connects and communicates, officially opened its Silicon Glen office in East Kilbride, Scotland, today. The new Kandou facility can accommodate…
Volume Shipping Under Way for PC Customer Systems LAUSANNE, SWITZERLAND –– January 20, 2022 –– Kandou today announced it has secured foundry capacity and backend IC packaging and testing services to meet all 2022 customer requirements for its Matterhorn™ USB-C® multiprotocol retimer with USB4™ support. The innovative leader in high-speed, energy-efficient…