Tigerwing Archives - Kandou AI

Category: Tigerwing

  • Delivering Breakthrough Chip-to-Chip Connectivity with Tigerwing™

    Delivering Breakthrough Chip-to-Chip Connectivity with Tigerwing™

    At the end of August 2025, we announced a breakthrough in chip connectivity: the successful tape-out of Tigerwing™, our next-generation chip-to-chip interconnect IP, on TSMC’s leading-edge process node. In just four months from concept to tape-out, our team achieved a milestone that sets new benchmarks for innovation, performance, and speed…