Kandou AI partners with our customers to revolutionize AI hardware systems across four key verticals:
Kandou AI’s Memory Fabric enables usage of low-cost GPUs with large Tier-2 memory footprint which is ideally suited for Mixture of Experts model architectures.
Up to 12x reduction in capex costs
+ 7.5x reduction in TCO
Kandou AI’s fabric solutions enable design of network attached large memory pools to offload collective operations for AI Training, significantly enhancing scalability, performance, and cost-effectiveness for deploying complex AI models.
Over 32x more scalability
Kandou AI’s CXL controllers offer massive switchless memory systems enabling usage of low-cost single socket servers for large in-memory databases.
Up to 2.5x reduction in capex cost
+ 4x increase in bandwidth
Our IO chiplets for Field-Repairable Co-Packaged Optics (CPO) improve thermal design, increase reliability, and significantly reduce repair times for optical components.
Over 10x reduction in repair time and costs
All Kandou AI products are powered by our innovative and silicon proven wired Copper Multiple Input Multiple Output (MIMO) interconnect technology. We leverage this technology to deliver chiplet-based AI fabric solutions that enable our customers to build massively scalable AI systems with unprecedented reductions in expenditure.
Artificial Intelligence will transform every industry, just as electricity did in the last industrial revolution – but only if the cost of AI systems dramatically decreases.
At Kandou AI, our mission is to democratize AI by doing just that - delivering products that empower customers to build affordable, scalable, and energy-efficient AI systems worldwide.
GTC 2025
More updates on Kandou AI will be coming soon. If you want to be ahead of the curve, get in touch with our sales team sales@kandou.ai