Glasswing - IP Solutions - Kandou

Introducing GlasswingTM

Simplicity. Versatility. Originality.

Glasswing PHY makes almost every IP interface better. Designed to utilize CNRZ-5 Chord™ Signaling, the Glasswing chip-to-chip link IP solution gives you more bits with lower power and fewer pins, without sacrificing margins. From enabling deep learning workloads to accelerating time to market, the possibilities are endless.
Key Features

What does a Glasswing IP solution do?

Glasswing silicon chiplets can be used to create a bespoke chiplets ecosystem, connecting chips in any configuration with high performance and ultra-short SerDes.
All About The Pins

Because CNRZ-5 Chord™ signaling simultaneously sends five bits of data over six correlated wires, you get double the bandwidth at half the power. Chord™ provides higher throughput (500 Gbits/s) per pin than equivalent NRZ solutions, and inherently lower power per bit than equivalent PAM-4 solutions.

 

Why Glasswing™?

Do more with Chord™ Signaling

The only USR SerDes IP proven in low-cost silicon, and capable of providing 1Tbps bandwidth at under one watt, Glasswing offers the power savings and reliability essential for networking, high-performance computing, AI and ML. So from online shopping to satellite communications, you can do so much more.

Why Glasswing™?

Massive Bandwidth

Glasswing can be tiled in both directions to deliver terabits of bandwidth between dies. At 25GB/s, Glasswing offers double the bandwidth of the current UCIe standard, at a fraction of the size.

Why Glasswing™?

Supports Large MCMs

Glasswing can tolerate exceptionally high levels of loss whilst maintaining signal integrity. So you can work with the largest MCMs efficiently, using corner turning and extended reach to expand your designs and integrate a far more complex collection of dies.

Why Glasswing™?

Outstanding Diagnostics

Glasswing’s built-in EyeScope shows you signal strength in real time. So you can debug and test links quickly and easily, with full confidence in the end signal quality.

Built-in Versatility

Divide your chip more flexibly
Divide your chip more flexibly
Assemble multiple dies or chiplets in the best configuration for your design.
No interposer
No interposer
Because Glasswing works with a substrate, you can save money by avoiding awkward silicon interposers.
Scale down
Scale down
Reduce the size of your largest die in order to enhance its yield or address reticle size limits.
Existing ecosystem
Existing ecosystem
You’re not on your own with Glasswing. There’s already a whole ecosystem of existing users to learn from and share insights.

Applications

Increased yield, decreased power
Increased yield, decreased power
Hyperscalers and data centers
Next level reliability
Next level reliability
Aerospace and defense
Effortless diagnostics
Effortless diagnostics
Automotive
More applications
Pure agility and speed
Pure agility and speed
5G infrastructure and equipment
Accelerate time to market
Accelerate time to market
Consumer space
Endless configurations. Infinite possibilities
Endless configurations. Infinite possibilities
AI, ML, deep learning
Key Features
  • 500 Gbit/s of bidirectional throughput
  • 1.04 pJ/bit or 1 Tbit/s per Watt
  • Beachfront bandwidth: 208 Gbit/s/mm die edge
  • 6 dB insertion loss budget (40+ mm on GZ-41 substrate)
  • Standard 150 μm bump pitch, so no interposer required
  • Low, fixed latency
  • Native BER of 1E-15
  • Optional Forward Error Correction (FEC) can be implemented to improve BER well below 1E-20
  • PRBS pattern generators and loopback modes
  • Protocol agnostic
  • Built-in EyeScope and advanced diagnostics
Documentation

The following is available to support your
evaluation and development with Glasswing.

Product Briefs
GW12-500-USR

Want more information?

Get in touch with our team

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