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Kandou Bus S.A., the global pioneer in multi-wire SerDes technology, today announced the introduction of the GlasswingTM USR SerDes, enabling the assembly of multiple chiplets inside a shared package without the need for costly silicon interposers. While advanced CMOS processes continue to provide a path for integration, there has been an increasing rise in costs associated with yield loss and with the design of large devices. Customers in networking, hyperscale datacenters, AI/machine learning and high-performance computing are now seeing the value of using the Glasswing USR SerDes to disaggregate large SoCs into smaller, more manageable pieces and pushing only necessary blocks into advanced processes.

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Kandou also to co-host USR Alliance panel and participate in OIF CEI-112G Panel

Kandou Bus has announced that it will demonstrate its GlasswingTM USR SerDes technology at the DesignCon 2018 Conference, co-host a panel announcing a new industry consortium for developing USR solutions, and participate in an Optical Internetworking Forum (OIF) panel.


The Optical Internetworking Forum (OIF) has published their CEI 4.0 Interoperability Agreement (IA) that contains a clause using Ensemble Non-Return-to-Zero (ENRZ) signaling, which was developed and first proposed by Kandou Bus. 

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Kandou has also developed an optional, low-latency Forward Error Correction (FEC) block that can be layered on top of the Glasswing hard macro

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** Kandou 500Gbps Serdes IP Targets 2.5D ** Kandou’s new 16nm Glasswing hard macro enables 500Gbps interfaces between die in a 2.5D package. The IP core implements the company’s unique protocol for 5-bit over 6-wire > signaling.

The Linley Group


Testing of our Glasswing 16nm test chip is proceeding very well. This IP will deliver 500Gbps and is optimized for die-to-die interconnect inside a 150um bump pitch MCM package.

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We just received our GW16-500-USR test silicon back from the foundry and have it up and running on test boards with open eyes on all channels! We are now working through debug and full test/char across all silicon corners.

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Kandou was elected among the top 60 emerging companies to watch by EE Times, the online news outlet that covers everything that is important in the electronics industry.


Kandou Bus, S.A., the world’s highest performance and lowest energy SerDes technology company, has announced that it has completed a $15M investment with Bessemer Venture Partners. The resources will enable Kandou to expand research and accelerate the development, productization and deployment of Kandou’s Chord™ signaling SerDes technology. Kandou has developed Chord signaling for enhanced communications between chips inside electronic systems ranging from cell phones to servers and high performance computing.

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Kandou Bus has announced that their Glasswing™ GW28-125-USR interface macro that has been manufactured, tested and characterized, is compliant to the newly published JEDEC specification, JESD247. Titled the “Multi-Wire, Multi-Level Interface Specification”, this new specification was published by the JEDEC standards development organization in June. Kandou actively participated in the effort to define this interface, and David Stauffer of Kandou served as the chair of the JEDEC task group that produced the text. As an active JEDEC member and in full compliance with membership terms and conditions, Kandou has committed to adhere to the RAND, Reasonable and Non-Discriminatory, terms of the JEDEC standards body for the licensing of the Kandou patents to that are needed to implement this interface.