Kandou Bus S.A., the global pioneer in multi-wire SerDes technology, today announced the introduction of the GlasswingTM USR SerDes, enabling the assembly of multiple chiplets inside a shared package without the need for costly silicon interposers. While advanced CMOS processes continue to provide a path for integration, there has been an increasing rise in costs associated with yield loss and with the design of large devices. Customers in networking, hyperscale datacenters, AI/machine learning and high-performance computing are now seeing the value of using the Glasswing USR SerDes to disaggregate large SoCs into smaller, more manageable pieces and pushing only necessary blocks into advanced processes.Read more
Kandou also to co-host USR Alliance panel and participate in OIF CEI-112G Panel
Kandou Bus has announced that it will demonstrate its GlasswingTM USR SerDes technology at the DesignCon 2018 Conference, co-host a panel announcing a new industry consortium for developing USR solutions, and participate in an Optical Internetworking Forum (OIF) panel.
Kandou has also developed an optional, low-latency Forward Error Correction (FEC) block that can be layered on top of the Glasswing hard macroRead more
Testing of our Glasswing 16nm test chip is proceeding very well. This IP will deliver 500Gbps and is optimized for die-to-die interconnect inside a 150um bump pitch MCM package.Read more
We just received our GW16-500-USR test silicon back from the foundry and have it up and running on test boards with open eyes on all channels! We are now working through debug and full test/char across all silicon corners.Read more
Kandou was elected among the top 60 emerging companies to watch by EE Times, the online news outlet that covers everything that is important in the electronics industry.
Kandou Bus, S.A., the world’s highest performance and lowest energy SerDes technology company, has announced that it has completed a $15M investment with Bessemer Venture Partners. The resources will enable Kandou to expand research and accelerate the development, productization and deployment of Kandou’s Chord™ signaling SerDes technology. Kandou has developed Chord signaling for enhanced communications between chips inside electronic systems ranging from cell phones to servers and high performance computing.Read more
Kandou Bus has announced that their Glasswing™ GW28-125-USR interface macro that has been manufactured, tested and characterized, is compliant to the newly published JEDEC specification, JESD247. Titled the “Multi-Wire, Multi-Level Interface Specification”, this new specification was published by the JEDEC standards development organization in June. Kandou actively participated in the effort to define this interface, and David Stauffer of Kandou served as the chair of the JEDEC task group that produced the text. As an active JEDEC member and in full compliance with membership terms and conditions, Kandou has committed to adhere to the RAND, Reasonable and Non-Discriminatory, terms of the JEDEC standards body for the licensing of the Kandou patents to that are needed to implement this interface.
Kandou Bus announced today that their Glasswing™ chip-to-chip link technology has been licensed by Marvell Technology Group for use in a variety of future multi-chip products. Based on Kandou’s CNRZ-5 Chord™ signaling architecture, Glasswing delivers high bandwidth signaling at very low power and is ideally suited for short links inside and outside a package. Glasswing is the world’s first SerDes proven in silicon that is capable of delivering 1Tbps bandwidth at <1 watt, paving the way for fundamental architectural shifts in power savings in devices ranging from cell phones to enterprise and high-performance computing platforms.Read more