Kandou

Application

Overview

Long reach links

Ideal for high speed and low power transmission of data on electrical backplane links. Standardized by the OIF (CEI-56G-LR-ENRZ).

Memory links

Superior signal integrity, low latency, and low power make our links ideal for different types of memory applications.

System in-package

Ideal for very low power and ultra high speed communication of data between dies in a low-cost package. By transmitting data at high speed over fewer wires, our Glasswing technology makes expensive interposers obsolete and in-package integration affordable for a wide range of applications.

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