Kandou Glasswing SerDes Early Test Results

For media enquiries, contact Jeff McGuire at jeff@kandou.com or on +1 303-903-9244

Measure Power of 0.8pJ/bit!

Testing of our Glasswing 16nm test chip is proceeding very well. This IP will deliver 500 Gbps and is optimized for die-to-die interconnect inside a 150 um bump pitch MCM package. A few highlights of our testing include:

  • TX and RX PLLs locking reliable at full rate
  • Error-free operation of all in-package links using PRBS (both internal and external pattern checkers)
  • Preliminary measured power under nominal conditions is 0.8 pJ/bit; within 1-2% of our simulations!

Testing is essentially complete and characterization will start this week (week of 21 Aug 2017). Full test/char across all foundry process corners is scheduled for completion in mid-November.

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